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Micro-Electronics Assembler

Description

Micro-Electronics
Assembler

This
position is for the assembly of miniaturized electronics (bare die and chip
components) for Hybrids, Multi-chip Modules, and Radio Frequency (RF) modules.
The Micro Electronics Assembler performs manual placement of Microwave components
and hand soldering of Microwave assemblies.

Specific duties will vary but
require a high degree of fine motor skills to manually place and bond miniature
electronic components under a microscope.

Examples of duties include:

  • Setting up
    and operating manual deep-access Wedge-bonders, Ball-bonders, Epoxy Die attach,
    Eutectic Die attach, Micro-welders and Wire-pull testers.
  • The Micro Electronics
    Assembler may also setup and operate automated placement and bonding equipment.

About Textron Systems:

Textron Systems businesses are industry leading developers and integrators of unmanned systems, advanced marine craft, armored vehicles, intelligent battlefield and surveillance systems, geospatial management and analysis systems, intelligence software solutions, precision weapons, piston engines, test and training systems, and total lifecycle sustainment and operational services. Textron Systems businesses consist of Electronic Systems, Geospatial Solutions, Lycoming Engines, Marine & Land Systems, Support Solutions, Unmanned Systems, Weapon & Sensor Systems and TRU Simulation + Training.

Textron Systems Electronic Systems designs and develops test and simulation hardware and software for Electronic Warfare (EW) applications. This includes systems used on the flight line, range or in a lab to simulate enemy radar or missile threats for the purpose of testing aircraft sensors and electronics, or for training a pilot. High fidelity software and hardware design is required to accurately simulate threats in an ever evolving and expanding electromagnetic threat environment.

Qualifications

Required
Skills:

  • Ability
    to manually place and bond miniaturized electronic components under a
    microscope within a defined period-of-time.
  • Hot plate soldering experience.
  • General and specialized knowledge of Micro-electronics assembly techniques.
  • Ability to use precision measuring instruments and micro-electronics
    fabrication machinery.
  • Ability to read and analyze complex instructions and
    procedures, engineering drawings, schematics and specifications.
  • Ability to
    locate and analyze complex production problems.
  • Ability to organize tasks and
    effectively communicate with others.
  • Knowledge of assembly procedures,
    processes, and quality specifications.
  • Ability to work independently and as
    part of a team.
  • Ability to work with people in a collaborative environment and
    earn the respect of peers.
  • Applicants need to be self-motivated, conscientious,
    and willingly to learn.
  • Team player mentality and evidence of good
    interpersonal skills.

Required
Experience:

  • HS
    diploma and two or more years experience in micro-electronics assembly is
    required. Associates degree in a related technical field in preferred.
  • Must be
    able to demonstrate an understanding of techniques used during the
    manufacturing process of Hybrids, Multi-chip Modules, and RF modules.
  • Must also
    be able to identify materials used during the manufacturing process.
  • Must be
    familiar with pre-cap inspection criteria based on traditional Mil Spec
    guidelines in conjunction with industry accepted best commercial practices.
  • This position requires use of information which is subject to the International Traffic in Arms Regulations (ITAR). All applicants must be U. S. persons within the meaning of ITAR. ITAR defines a U. S. person as a U. S. Citizen, U. S. Permanent Resident (i. e. 'Green Card Holder'), Political Asylee, or Refugee.


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